After a bit of gap, I am back in circulation. This time, I’m under the flag of EngTechnica, my latest venture.

It’s been a whirlwind of events. COMSOL in Boston two weeks, Bentley’s Year in Infrastructure in Vancouver last week, tomorrow I drive down to San Diego for Autodesk University, then on to the TheWave in Tempe, AZ. Next month, it’s Trimble Dimensions in Las Vegas. Ugh. Not my favorite city.

Free, free, free at last. It’s great to go where I need to go and write about the cool technology I see. With AI bursting upon the scene, CAD, CAM and CAE, my favorite subjects, got exciting again. I’ve been in CAD for 40 years and publishing for almost 30 years. Never have I seen so much excitement. One event after another is hijacked by AI, how it is being implemented… or how it will be or should be.

Here I go again. You can follow me on EngTechnica.